Forty-Two Years of Inference Chips
Six windows cut 1985–2026 custom computing; against the optical-communications boom, the constraint has moved from fabs to HBM, advanced packaging and the grid.
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Six windows rebuild the 1985–2026 inference-chip cycle against the optical-communications boom, with every chart traceable to a dated primary source.
Switch to Forty Years of Memory
Swaps the subject to the DRAM and NAND memory industry, rebuilding cycles and exit grammar with the same time windows.
Try Deep ResearchCreate a Chinese-language interactive industry research page titled "Forty-Two Years of Inference Chips". Cut the 1985–2026 custom computing industry into six time windows and rebuild the evidence observable at each point: three generations of challengers entered, two shakeouts occurred, and exits were mostly through acquisition. The core chapter compares the 1995–2000 optical-communications boom with the 2023–2026 inference-chip boom, arguing that the constraint has moved from wafer fabs to HBM, advanced packaging and the power grid. Require magazine-grade Chinese long-form typography, timeline navigation, and every chart traceable to a dated primary source; end with two scenario projections, three bold hypotheses and eight observation triggers, state that the page is for information only and does not constitute investment advice, and deliver a single file that opens offline.
Make an English Version
The same six-window structure and evidence chain, output as the English research page Forty-Two Years of Inference Silicon.
Try Deep ResearchCreate a Chinese-language interactive industry research page titled "Forty-Two Years of Inference Chips". Cut the 1985–2026 custom computing industry into six time windows and rebuild the evidence observable at each point: three generations of challengers entered, two shakeouts occurred, and exits were mostly through acquisition. The core chapter compares the 1995–2000 optical-communications boom with the 2023–2026 inference-chip boom, arguing that the constraint has moved from wafer fabs to HBM, advanced packaging and the power grid. Require magazine-grade Chinese long-form typography, timeline navigation, and every chart traceable to a dated primary source; end with two scenario projections, three bold hypotheses and eight observation triggers, state that the page is for information only and does not constitute investment advice, and deliver a single file that opens offline.
Add a Survivor Comparison Tool
Adds a survivor-record module with user-selectable companies, showing each one's entry, pivot and exit points window by window.
Try Deep ResearchCreate a Chinese-language interactive industry research page titled "Forty-Two Years of Inference Chips". Cut the 1985–2026 custom computing industry into six time windows and rebuild the evidence observable at each point: three generations of challengers entered, two shakeouts occurred, and exits were mostly through acquisition. The core chapter compares the 1995–2000 optical-communications boom with the 2023–2026 inference-chip boom, arguing that the constraint has moved from wafer fabs to HBM, advanced packaging and the power grid. Require magazine-grade Chinese long-form typography, timeline navigation, and every chart traceable to a dated primary source; end with two scenario projections, three bold hypotheses and eight observation triggers, state that the page is for information only and does not constitute investment advice, and deliver a single file that opens offline.